The global thermal interface materials market is expected to grow from $3.1 billion in 2021 to $7.4 billion by 2030, growing at a CAGR of 10.2% from 2022 to 2030. he thermal interface is developing rapidly due to the increasing demand for downsizing of electronic devices. , the growing LED industry and the increased use of TIMs in end-use industries. Increased demand for high-quality electronic products resulting from new consumer electronics product launches and advancements in technology is expected to drive the demand for thermal interface materials. Additionally, growing demand for advanced technical devices and specialized electronics for high-end operations is expected to drive the market throughout the forecast period.
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Thermal interface materials (TIM) are intermediate materials placed between the heat sink and devices to improve thermal transmission to the heat sink. They are used in a variety of electronic applications including electric cars, desktop processors/computers, cell phones, tablets, architectural and industrial lighting, and many more. Demand from major end-user sectors such as consumer electronics is the primary driver of this business. Tapes and films, phase transition materials, gap fillers, greases and adhesives, metal-based TIMs, and other types of thermal interface materials are commercially available.
Impact of COVID-19 on the Global Thermal Interface Materials Market
The TIM market has seen a decline in demand, but it has been informed compared to other key industries. Teleconferencing and remote working technologies are becoming increasingly popular, indicating growth in the telecommunications industry. The sale of PCs, laptops, video games and smartphones has increased as more organizations implement work-from-home policies. People who stay at home want individual consumer gadgets for personal use, which has increased the demand for durable consumer goods. During the pandemic, the demand for TIM in medical equipment has increased due to the rapid increase in demand for medical machinery.
Global Thermal Interface Materials Market Dynamics
Drivers: the growing proliferation of electronic devices
Overheating is a major risk for next-generation electronics in most major industries. Many electronic component production trends have also focused on device miniaturization, which further complicates high-performance cooling. TIMs are fundamental to solving the thermal stresses of contemporary electronic assembly designs. They improve the thermal interaction between heat-generating electronics and cooling components, increasing power capacity and durability while minimizing the overall cost of the finished assembly. It is an ideal material that conforms to contact surfaces, wets all over the substrate and is as thin as possible. These materials are an essential component of any thermal management system. It’s an easy component to overlook because it’s only a minor fraction of most applications.
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Constraints: physical qualities limit its performance
On the other hand, thermal interface material can make or break a device and its associated product. TIMs are inserted into the joint to fill air voids and are a crucial component of an assembly when solid surfaces are joined to reduce contact resistance. Although the introduction of TIMs improves heat transport across an interface, it is commonly believed that TIMs also account for the majority of a system’s thermal resistance.
Opportunities: the growing trend towards miniaturization of electrical devices
Growing demand for miniaturization and mechanization of electronic products such as mobile phones, touch screens and monitors, and medical equipment is propelling the TIM market. As electronics get smaller, the components become more concentrated causing them to overheat. This increases the heat density on the surface of the electrical equipment. Heat dissipation requires the use of TIM. The growing global demand for these electronic items has increased the use of TIMs in the electronics industry.
The study categorizes the global thermal interface materials market based chemistry, type and applications at regional and global level.
By chemistry (revenue, billion USD, 2017-2030)
Others (acrylics, polyurethanes and cyanate esters)
By type (revenue, billion USD, 2017-2030)
Greases & Adhesives
Tapes & Movies
Phase change materials
Others (elastomeric/insulating pads and thermal compounds)
By Application (Revenue, USD Billion, 2017-2030)
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Durable consumer goods
By Region (Revenue, USD Billion, 2017-2030)
The rest of Europe
Australia and New Zealand
Rest of Asia-Pacific
Rest of South America
The Middle East and Africa
United Arab Emirates
Rest of MEA
The silicone segment of the global thermal interface materials market is expected to account for the highest share of the global market
The global thermal interface materials market is segmented into epoxy, silicone, polyimide and others based on chemistry. Among them, silicone is expected to show high growth potential in the thermal interface materials market across the globe owing to its outstanding qualities such as temperature fluctuation stability, vibration and shock resistance, stability to mechanical stress and resistance to chemical attack, thereby increasing segmental growth. .
Asia-Pacific accounts for the highest CAGR over the forecast period in the global thermal interface materials market
Asia-Pacific region is estimated for the highest CAGR during the forecast period in the global thermal interface materials market in the coming years. Four main countries namely China, India, Japan and rest of Asia-Pacific are analyzed in Asia-Pacific. Due to its rapid industrialization, increasing per capita income, population growth, Internet user base, and development of end-use industries. These are some major factors contributing to the growth of the thermal interface materials market in this region.
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Main Market Players The main market players are:
Henkel AG & Co. KgaA
Honeywell International Inc.
Parker Hannifin Corporation
Dow Corning Company
Momentive Performance Materials
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